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This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging.

With the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high temperatures environment from both theoretical analysis and real experiments evaluation.

In thermal simulation, considering on board chips’ power consumption as additional heat source, the highest temperature point reached by all the chips in the circuit is only 211 °C at work temperature of 200 °C. In addition, the proposed circuit was validated by long time high-temperature experiments. The circuit showed good dynamic performance during a 4-h test in a 200-°C oven, and maintained a signal-to-noise ratio of 92.54 dB, a signal-to-noise and distortion ratio of 91.81 dB, a total harmonic distortion of −99.89 dB and a spurious free dynamic range of 100.28 dB.

The proposed circuit and methodology showed great potential for application in deep-well logging systems and other high-temperature situations.

This study aims to explore the effect of innovation ecosystem stability (IES) on innovation performance of enterprises through the mediating role of knowledge acquisition (KA), and to study how these effects are moderated by unabsorbed slack.

This study draws on data from 327 Chinese enterprises and adopts the multiple linear regression method and bootstrapping method to explore the mediating effect of KA and its moderated mediating effect.

The results demonstrate that IES is positively associated with innovation performance of enterprises, and KA plays a partially mediating role. Moreover, unabsorbed slack negatively moderates the relationship between IES and KA as well as the mediating effect of KA.

This study investigates the relationship between IES and innovation performance, and the mechanism of influence, which has not been previously studied in the field of innovation ecosystem. This study also examines the interaction between unabsorbed slack and IES and further clarifies the mechanism and boundary conditions of the impact of IES on innovation performance.